PLATING METHOD FOR MANUFACTURING MULTI LAYER PCB

摘要

The present invention relates to a copper plating method for a multi-layer PCB without generating foreign material by using ion palladium. An electroless copper plating method for a penetrating hole of a multi-layer PCB in which a plurality of conductors and insulators are alternately laminated by using a conductive palladium ion solution, includes the steps of: A) attaching negative ionic or non-ionic surfactant to an inner wall of a penetrating hole by degreasing the multi-layer PCB; and B) removing remaining surfactant except for the surfactant attached to the surface of the insulator by cleaning and etching the multi-layer PCB, as a pre-process of catalyst-processing the multi-layer PCB with a conductive palladium ion solution. Upon catalyst processing, a failure during copper plating caused by a foreign material generated when negative ionic or non-ionic surfactant are condensed with the conductive palladium ion being introduced into the surface of the multi-layer PCB and generating shorts can be prevented.