发明名称 |
Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures |
摘要 |
A method and an apparatus for mitigating electrical failures caused by intrusive structures. Such structures can be tin whiskers forming on electrical circuits. In an illustrative embodiment, nano-capsules are filled with some type of insulative and adhesive fluid that is adapted to bind to and coat an intrusive structure, e.g., a whisker, making the whisker electrically inactive and thereby reducing the electrical faults that can be caused by the whisker. In another illustrative embodiment, randomly oriented nano-fibers having an elastic modulus higher than tin or any other whisker material is used to arrest a growth or movement of a whisker and further reduce a likelihood that a whisker can cause an electrical fault. |
申请公布号 |
US8907225(B1) |
申请公布日期 |
2014.12.09 |
申请号 |
US201414221833 |
申请日期 |
2014.03.21 |
申请人 |
The United States of America as represented by the Secretary of the Navy |
发明人 |
Deshpande Nishkamraj U;Barsun H. Fred;Shoultz Ron |
分类号 |
H05K1/02;H05K3/28;H01L23/31;H05K3/30 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
Monsey Christopher A. |
主权项 |
1. An intrusive structure mitigation system comprising:
a plurality of first structures formed to encapsulate a liquid with insulative and adhesive properties which is formed or adapted to rupture or fracture upon a first pressure or intrusion event by a second structure and thereby enable said liquid to exit said rupture or fracture of at least one of said first structures upon occurrence of said first pressure or intrusion event; and a first matrix material adapted to position and bond the plurality of first structures substantially distributed through or in relation to the first matrix material; wherein said liquid is adapted to form an insulated coating on said second structure which intrudes or ruptures any one of said first structures thereby making at least a portion of the second structure electrically insulated from at least a portion of said second structure's environment or components said second structure comes in physical contact with or proximity with; wherein said first matrix material is configured to bond to a conformal coating of a third structure comprising electrical components or conductors. |
地址 |
Washington DC US |