发明名称 Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures
摘要 A method and an apparatus for mitigating electrical failures caused by intrusive structures. Such structures can be tin whiskers forming on electrical circuits. In an illustrative embodiment, nano-capsules are filled with some type of insulative and adhesive fluid that is adapted to bind to and coat an intrusive structure, e.g., a whisker, making the whisker electrically inactive and thereby reducing the electrical faults that can be caused by the whisker. In another illustrative embodiment, randomly oriented nano-fibers having an elastic modulus higher than tin or any other whisker material is used to arrest a growth or movement of a whisker and further reduce a likelihood that a whisker can cause an electrical fault.
申请公布号 US8907225(B1) 申请公布日期 2014.12.09
申请号 US201414221833 申请日期 2014.03.21
申请人 The United States of America as represented by the Secretary of the Navy 发明人 Deshpande Nishkamraj U;Barsun H. Fred;Shoultz Ron
分类号 H05K1/02;H05K3/28;H01L23/31;H05K3/30 主分类号 H05K1/02
代理机构 代理人 Monsey Christopher A.
主权项 1. An intrusive structure mitigation system comprising: a plurality of first structures formed to encapsulate a liquid with insulative and adhesive properties which is formed or adapted to rupture or fracture upon a first pressure or intrusion event by a second structure and thereby enable said liquid to exit said rupture or fracture of at least one of said first structures upon occurrence of said first pressure or intrusion event; and a first matrix material adapted to position and bond the plurality of first structures substantially distributed through or in relation to the first matrix material; wherein said liquid is adapted to form an insulated coating on said second structure which intrudes or ruptures any one of said first structures thereby making at least a portion of the second structure electrically insulated from at least a portion of said second structure's environment or components said second structure comes in physical contact with or proximity with; wherein said first matrix material is configured to bond to a conformal coating of a third structure comprising electrical components or conductors.
地址 Washington DC US