发明名称 Light module
摘要 An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.
申请公布号 US8907550(B2) 申请公布日期 2014.12.09
申请号 US201013054030 申请日期 2010.03.16
申请人 Molex Incorporated 发明人 Zaderej Victor;McGowan Daniel B.;Picini Michael C.
分类号 F21V7/20;F21V29/00;F21K99/00;F21Y101/02 主分类号 F21V7/20
代理机构 代理人 Sheldon Stephen L.
主权项 1. A light module comprising: a light emitting diode (LED) array defining a first area, the LED array including an anode and a cathode; a heat spreader including a support region with a second area that supports and is thermally coupled to the LED array, the heat spreader having an outer edge and further including an aperture positioned between the outer edge and the support region, the heat spreader defining a third area; a base formed from an insulative material, the base supporting the heat spreader and LED array, the base including a first plated surface and a second plated surface that are separated by the insulating material, the insulative material having a thermal conductivity of less than ten (10) W/m-k; and a thermal channel positioned in the base, the thermal channel being plated and configured so that the thermal channel extends from the first surface to the second surface.
地址 Lisle IL US