Method for fabricating a semiconductor device

摘要

A semiconductor device and a method for making a semiconductor device are disclosed. In an embodiment a semiconductor device includes a semiconductor chip and a fiber reinforced encapsulation layer at least partly covering the semiconductor chip.

主权项

1. A method for fabricating a semiconductor device, the method comprising:
placing a semiconductor chip onto a carrier; and applying a fiber reinforced encapsulant material over the semiconductor chip, wherein applying the fiber reinforced encapsulant material comprises applying the fiber reinforced encapsulant material in such a way that the fibers extend only laterally beside the semiconductor chip.