| 摘要 |
<p>The present invention relates to a printed circuit board manufacturing method in a role-to-role method using a conductive paste, for uniformly manufacturing a thin substrate without a plating process, increasing productivity by applying a role-to-role method, and reducing resistance change rate and defects such as cracks. The printed circuit board manufacturing method in a role-to-role method using the conductive paste includes a preparing process for supplying a combination body in which an insulating layer is coupled with a first conductive layer and supplied from a first supply reel in a role-to-role method; a hole manufacturing method for manufacturing a through hole on the insulating layer of the combination body; a printing process for injecting the conductive paste in the through hole; and an insulation combining process in which a second conductive layer is supplied from a third supply reel, around which the second conductive layer is coiled, in a role-to-role method, and is laminated on the insulating layer.</p> |
