发明名称 |
Duplexer |
摘要 |
A duplexer includes: an insulation substrate having an upper surface on which a transmission filter and a reception filter are mounted, and a lower surface on which a foot pad layer electrically connected to the transmission filter and the reception filter is formed; a transmission pad provided on the upper surface and electrically connected to the transmission filter; a reception pad provided on the upper surface and electrically connected to the reception filter, a ring-shaped electrode provided on the upper surface and configured to surround the transmission pad and the reception pad; a ground foot pad included in the foot pad layer, and a via interconnection configured to electrically interconnect the ring-shaped electrode and the ground foot pad and to be provided in the ring-shaped electrode in a section along a shorter one of routes that connect the transmission pad and the reception pad to each other along the ring-shaped electrode. |
申请公布号 |
US8907740(B2) |
申请公布日期 |
2014.12.09 |
申请号 |
US201113291269 |
申请日期 |
2011.11.08 |
申请人 |
Taiyo Yuden Co., Ltd. |
发明人 |
Tsutsumi Jun;Iwaki Masafumi;Nakamura Hiroshi |
分类号 |
H03H9/00;H03H9/05;H03H9/70;H03H9/72;H03H9/10 |
主分类号 |
H03H9/00 |
代理机构 |
Chen Yoshimura LLP |
代理人 |
Chen Yoshimura LLP |
主权项 |
1. A duplexer comprising:
an insulation substrate having an upper surface on which a transmission filter and a reception filter are mounted, and a lower surface on which a foot pad layer electrically connected to the transmission filter and the reception filter is formed; a transmission pad provided on the upper surface and electrically connected to the transmission filter; a reception pad provided on the upper surface and electrically connected to the reception filter, a ring-shaped electrode provided on the upper surface and configured to surround the transmission pad and the reception pad; a ground foot pad included in the foot pad layer, and a via interconnection configured to electrically interconnect the ring-shaped electrode and the ground foot pad and to be provided in the ring-shaped electrode in a section along a shorter one of routes that connect the transmission pad and the reception pad to each other along the ring-shaped electrode. |
地址 |
Tokyo JP |