Millimeter wave wafer level chip scale packaging (WLCSP) device and related method

摘要

Various embodiments include wafer level chip scale package (WLCSP) structures and methods of tuning such structures. In some embodiments, the WLCSP structure includes: a printed circuit board (PCB) trace connection including at least one PCB ground connection connected with a PCB ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including: a signal trace connection electrically isolated from the PCB ground plane; a signal ball contacting the signal PCB trace connection; a chip pad contacting the signal ball, and a signal trace connection on a chip contacting the chip pad.

主权项

1. A wafer level chip scale package (WLCSP) structure comprising:
a printed circuit board (PCB) trace connection including at least one PCB ground connection connected with a PCB ground plane; a set of ground solder balls each contacting the printed circuit board trace connection; a set of chip pads contacting each of the ground solder balls in the set of ground solder balls; a chip ground plane connecting the set of chip pads; and a signal interconnect interposed between two of the set of ground solder balls, the signal interconnect including:
a signal trace connection electrically isolated from the PCB ground plane,wherein the signal trace connection electrically isolated from the PCB ground plane includes a conductive strip which forms a microstrip line with the PCB ground plane for carrying a signal;a signal ball contacting the signal trace connection,wherein a diameter of the signal ball controls an amount of signal loss in the WLCSP structure;a chip pad contacting the signal ball; anda signal trace connection on a chip contacting the chip pad.