发明名称 High switching trench MOSFET
摘要 A shielded gate trench metal oxide semiconductor filed effect transistor (MOSFET) having high switching speed is disclosed. The inventive shielded gate trench MOSFET includes a shielded electrode spreading resistance placed between a shielded gate electrode and a source metal to enhance the performance of the shielded gate trench MOSFET by adjusting doping concentration of poly-silicon in gate trenches to a target value. Furthermore, high cell density is achieved by employing the inventive shielded gate trench MOSFET without requirement of additional cost.
申请公布号 US8907415(B2) 申请公布日期 2014.12.09
申请号 US201113108066 申请日期 2011.05.16
申请人 Force Mos Technology Co., Ltd. 发明人 Hsieh Fu-Yuan
分类号 H01L29/78;H01L29/40;H01L29/66;H01L29/08;H01L29/10;H01L29/417;H01L29/423;H01L29/45 主分类号 H01L29/78
代理机构 Bacon & Thomas, PLLC 代理人 Bacon & Thomas, PLLC
主权项 1. A power semiconductor device comprising: a plurality of gate trenches extending into a silicon layer of a first conductivity type; a gate electrode disposed in upper portion of each of said gate trenches and a shielded electrode disposed in lower portion of each of said gate trenches, wherein said gate electrode and said shielded electrode insulated from each other by an inter-electrode insulating layer; said gate electrode and said shielded electrode are doped poly-silicon layers wherein said gate electrode having doping concentration equal to or higher than said shielded electrode; said gate electrode connected to a gate metal through a gate electrode spreading resistance and said shielded electrode connected to a source metal through a shielded electrode spreading resistance; and said upper portion of said gate trenches surrounded by source regions of said first conductivity type and body regions of a second conductivity type in active area.
地址 New Taipei TW