| 发明名称 | Copper ball bond features and structure | ||
| 摘要 | An integrated circuit wire bond connection is provided having an aluminum bond pad (51) that is directly bonded to a copper ball (52) to form an aluminum splash structure (53) and associated crevice opening (55) at a peripheral bond edge of the copper ball (54), where the aluminum splash structure (53) is characterized by a plurality of geometric properties indicative of a reliable copper ball bond, such as lateral splash size, splash shape, relative position of splash-ball crevice to the aluminum pad, crevice width, crevice length, crevice angle, and/or crevice-pad splash index. | ||
| 申请公布号 | US8907485(B2) | 申请公布日期 | 2014.12.09 |
| 申请号 | US201213594732 | 申请日期 | 2012.08.24 |
| 申请人 | Freescale Semiconductor, Inc. | 发明人 | Higgins, III Leo M.;Lee Chu-Chung |
| 分类号 | H01L23/49;H01L21/607;H01L21/603;H01L23/485 | 主分类号 | H01L23/49 |
| 代理机构 | Terrile, Cannatti, Chambers & Holland, LLP | 代理人 | Terrile, Cannatti, Chambers & Holland, LLP ;Cannatti Michael Rocco |
| 主权项 | 1. An integrated circuit wire bond connection comprising: a copper bond wire comprising a copper ball and an aluminum bond pad that is directly bonded to the copper ball to form an aluminum splash structure and associated crevice opening between the aluminum splash structure and copper ball at a peripheral bond edge of the copper ball, where the aluminum splash structure is characterized by a first plurality of geometric features indicative of a reliable copper ball bond. | ||
| 地址 | Austin TX US | ||