| 发明名称 | Thermal via structures with surface features | ||
| 摘要 | Embodiments of the present disclosure describe apparatuses, methods, and systems of thermal via structures with surface features. In some embodiments the surface features may have dimensions greater than approximately one micron. The thermal via structures may be incorporated into a substrate of an integrated circuit device. Other embodiments may be described and/or claimed. | ||
| 申请公布号 | US8908383(B1) | 申请公布日期 | 2014.12.09 |
| 申请号 | US201213476923 | 申请日期 | 2012.05.21 |
| 申请人 | TriQuint Semiconductor, Inc. | 发明人 | Railkar Tarak A.;Bantz Paul D. |
| 分类号 | H05K7/02;H05K7/06;H05K7/08;H05K7/10 | 主分类号 | H05K7/02 |
| 代理机构 | Schwabe Williamson & Wyatt | 代理人 | Schwabe Williamson & Wyatt |
| 主权项 | 1. An apparatus comprising: a substrate comprising a first surface and a second surface opposite the first surface; an electronic component coupled with the first surface of the substrate; a circuit board coupled with the second surface of the substrate; and a thermal via structure disposed in the substrate, the thermal via structure including a thermally conductive material that includes surface features on the first surface and the second surface and arranged in a pattern of two or more partially overlapping shapes, the surface features having dimensions greater than approximately 1 micron, wherein the surface features on the first surface are in direct contact with the electronic component and configured to transfer heat sourced from the electronic component when operating to the circuit board. | ||
| 地址 | Hillsboro OR US | ||