发明名称 |
Adhesive agent composition and laminated body |
摘要 |
The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature. |
申请公布号 |
US8907025(B2) |
申请公布日期 |
2014.12.09 |
申请号 |
US201213980772 |
申请日期 |
2012.01.20 |
申请人 |
Toyo Ink SC Holdings Co., Ltd. |
发明人 |
Sugi Hiroki;Yasui Bungo;Maeda Seiji;Ueki Katsuyuki;Shimada Kenshiro |
分类号 |
C09J175/08;C08G18/08;C08L63/02;C08G18/48;C08G18/42;C08G18/32;C08G18/76;C09J175/06;C08G18/75;C08G18/10;C08G18/73;C08G18/58;C08G18/72;C09J11/06;C08G18/40 |
主分类号 |
C09J175/08 |
代理机构 |
Brinks Gilson & Lione |
代理人 |
Brinks Gilson & Lione |
主权项 |
1. An adhesive agent composition, comprising:
a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature. |
地址 |
Tokyo JP |