Window interposed die packaging

摘要

A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic substrate comprising at least one window-shaped cavity for mounting the at least one semiconductor die, the window substrate having interconnect structures. Furthermore, the at least one semiconductor die is positioned inside the at least one cavity and is connected to the interconnect structures, providing connections to another level of assembly or packaging of the semiconductor device. The invention also relates to a method of manufacturing such a semiconductor device.

主权项

1. A semiconductor device comprising:
at least one semiconductor die; a window substrate being an inorganic substrate comprising at least one cavity for mounting the at least one semiconductor die, wherein there are no electrical feedthroughs in the window substrate; and a substantially planar interconnect structure provided at at least one side of the window substrate, wherein the interconnect structure is pre-formed on a further substrate, the at least one semiconductor die being positioned inside the at least one cavity, and being connected to the interconnect structure adjacent the at least one semiconductor die, the interconnect structure forming an electrical connection between the at least one semiconductor die and another level of assembly or packaging of the semiconductor device.