Integrated circuit package

摘要

An integrated circuit package includes a digital logic die disposed on a substrate; and an interposer die stacked vertically with the digital logic die on the substrate. The interposer die includes at least one vertical transistor configured to selectively provide electrical power to a portion of the digital logic die.

主权项

1. An integrated circuit system comprising:
an interposer die comprising a plurality of sleep transistors; and a digital logic die stacked vertically with said interposer die, wherein said digital logic die comprises; a plurality of gated system elements, wherein a power supply to each of said gated system elements is independently gated by at least one of said sleep transistors in said interposer die, and a power manager module configured to selectively control said sleep transistors to selectively provide power to individual said gated system elements to manage power consumption in said system.