Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device

摘要

A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board formed with a through hole passing through in a thickness direction and a pressure-sensitive adhesive layer laminated on a surface at one side in the thickness direction of the support board so as to cover the through hole; disposing a semiconductor element on a surface at one side in the thickness direction of the pressure-sensitive adhesive layer in opposed to the through hole in the thickness direction; covering the semiconductor element with an encapsulating layer to produce an encapsulating layer-covered semiconductor element; and inserting a pressing member into the through hole from the other side in the thickness direction to peel the encapsulating layer-covered semiconductor element from the pressure-sensitive adhesive layer.

主权项

1. A method for producing an encapsulating layer-covered semiconductor element comprising:
a preparing step of preparing a support sheet including a hard support board formed with a through hole passing through an upper surface of the hard support board to a lower surface, and a pressure-sensitive adhesive layer laminated on the upper surface of the hard support board so as to cover the through hole; a semiconductor element disposing step of disposing a semiconductor element on an upper surface of the pressure-sensitive adhesive layer opposite the through hole; a semiconductor element covering step of covering the semiconductor element with an encapsulating layer to produce an encapsulating layer-covered semiconductor element including the semiconductor element and the encapsulating layer covering the semiconductor element; and a semiconductor element peeling step of inserting a pressing member into the through hole from the lower surface of the hard support board to press the pressure-sensitive adhesive layer corresponding to the through hole to relatively move the encapsulating layer-covered semiconductor element upward and peel the encapsulating layer-covered semiconductor element from the pressure-sensitive adhesive layer.