发明名称 |
Conductor for flexible substrate and fabrication method of same, and flexible substrate using same |
摘要 |
A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, according to the present invention comprises: a base conductor made of Cu or Cu-alloy; a plating film made of Sn or Sn-alloy formed on a surface of the base conductor; and a surface oxide film formed on a surface of the plating film, in which the surface oxide film includes oxide of an element other than Sn or a mixture of Sn oxide and oxide of an element other than Sn. |
申请公布号 |
US8907226(B2) |
申请公布日期 |
2014.12.09 |
申请号 |
US200812045727 |
申请日期 |
2008.03.11 |
申请人 |
Hitachi Metals, Ltd. |
发明人 |
Tsuji Takayuki;Horikoshi Toshiyuki;Ito Masato |
分类号 |
H05K1/03;H05K1/09;C25D11/02;H05K3/24;H05K1/11 |
主分类号 |
H05K1/03 |
代理机构 |
Antonelli,, Terry, Stout & Kraus, LLP. |
代理人 |
Antonelli,, Terry, Stout & Kraus, LLP. |
主权项 |
1. A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, comprising:
a base conductor made of Cu or Cu-alloy; a plated metal film made of Sn or Sn-alloy formed on a surface of the base conductor; and a surface oxide film formed directly on a surface of the plated metal film, wherein: the surface oxide film is made of an oxide comprising a mixture of Sn oxide and an oxide of an element other than Sn; and a thickness of the surface oxide film is equal to or less than 5 nm. |
地址 |
Tokyo JP |