发明名称 Conductor for flexible substrate and fabrication method of same, and flexible substrate using same
摘要 A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, according to the present invention comprises: a base conductor made of Cu or Cu-alloy; a plating film made of Sn or Sn-alloy formed on a surface of the base conductor; and a surface oxide film formed on a surface of the plating film, in which the surface oxide film includes oxide of an element other than Sn or a mixture of Sn oxide and oxide of an element other than Sn.
申请公布号 US8907226(B2) 申请公布日期 2014.12.09
申请号 US200812045727 申请日期 2008.03.11
申请人 Hitachi Metals, Ltd. 发明人 Tsuji Takayuki;Horikoshi Toshiyuki;Ito Masato
分类号 H05K1/03;H05K1/09;C25D11/02;H05K3/24;H05K1/11 主分类号 H05K1/03
代理机构 Antonelli,, Terry, Stout & Kraus, LLP. 代理人 Antonelli,, Terry, Stout & Kraus, LLP.
主权项 1. A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, comprising: a base conductor made of Cu or Cu-alloy; a plated metal film made of Sn or Sn-alloy formed on a surface of the base conductor; and a surface oxide film formed directly on a surface of the plated metal film, wherein: the surface oxide film is made of an oxide comprising a mixture of Sn oxide and an oxide of an element other than Sn; and a thickness of the surface oxide film is equal to or less than 5 nm.
地址 Tokyo JP