发明名称 |
Silicon nitride gate encapsulation by implantation |
摘要 |
A method of forming a FinFET structure which includes forming fins on a semiconductor substrate; forming a gate wrapping around at least one of the fins, the gate having a first surface and an opposing second surface facing the fins; depositing a hard mask on a top of the gate; angle implanting nitrogen into the first and second surfaces of the gate so as to form a nitrogen-containing layer in the gate that is below and in direct contact with the hard mask on top of the gate; forming spacers on the gate and in contact with the nitrogen-containing layer; and epitaxially depositing silicon on the at least one fin so as to form a raised source/drain. Also disclosed is a FinFET structure. |
申请公布号 |
US8906759(B2) |
申请公布日期 |
2014.12.09 |
申请号 |
US201313776324 |
申请日期 |
2013.02.25 |
申请人 |
International Business Machines Corporation |
发明人 |
Basker Veeraraghavan S.;Mehta Sanjay;Yamashita Tenko;Yeh Chun-Chen |
分类号 |
H01L29/78;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
Law Offices of Ira D. Blecker, P.C. |
代理人 |
Law Offices of Ira D. Blecker, P.C. |
主权项 |
1. A method of forming a FinFET structure comprising:
forming fins on a semiconductor substrate; forming a gate wrapping around at least one of the fins, the gate having a first surface and an opposing second surface facing the fins; forming a plurality of dummy gates across at least one of the fins such that there is a first dummy gate facing the first surface of the gate and a second dummy gate facing the second surface of the gate, the plurality of dummy gates performing no electrical function; depositing a hard mask on a top of the gate; angle implanting nitrogen into the first and second surfaces of the gate so as to form a nitrogen-containing layer in the gate that is below and in direct contact with the hard mask on top of the gate, wherein angle implanting nitrogen includes angle implanting nitrogen by a gas cluster ion beam process such that a silicon nitride layer is formed below and in direct contact with the hard mask on top of the gate as a direct result of the gas cluster ion beam process; forming spacers on the gate and in contact with the nitrogen-containing layer; and epitaxially depositing silicon on the at least one fin so as to form a raised source/drain. |
地址 |
Armonk NY US |