Plasma stamp, plasma treatment device, method for plasma treatment and method for producing a plasma stamp

摘要

The invention relates to a plasma stamp, with which surfaces can be subjected to a plasma treatment. In addition, the invention relates to a plasma treatment device, with which surfaces can be subjected to a plasma treatment, and also a plasma treatment method. In addition, the invention relates to a method for producing a plasma stamp.

主权项

1. A plasma stamp, comprising:
a gas-conducting layer including or consisting of at least one porous material; and at least one cavity which is in gas-permeable communication with the gas-conducting layer and includes an opening towards an underside of the plasma stamp, gas in the region behind the opening of the cavity being able to be conducted through the gas-conducting layer in a direction essentially parallel to the surface of the opening, wherein the cavity is disposed in a cavity layer, the cavity extending up to an upper side of the cavity layer and also up to an underside of the cavity layer situated opposite the upper side, wherein the gas-conducting layer abuts against the cavity on the upper side of the cavity layer, and comprising a gas-impermeable layer on a side of the gas-conducting layer that is orientated away from the underside of the plasma stamp, wherein the gas-impermeable layer includes a gas supply port and a gas discharge port that are together arranged such that the gas in the region behind the opening of the cavity is able to be conducted between the gas supply port and the gas discharge port through the gas conducting layer in a direction essentially parallel to the surface of the opening.