SINTERING DEVICE FOR BONDING LED CHIP

摘要

The purpose of the present invention is to provide a sintering device for bonding a LED chip which can selectively heat an LED chip at high temperatures by heating only an LED chip using a laser and curing adhesive, and can improve a curing process by reducing sintering time through rapid heating. In order to achieve the purpose, the sintering device comprises: a man body part in which a receiving space is formed and which holds an LED package; a laser module which is installed in the main body part and which performs the curing of adhesive by heating an LED chip by shooting a laser beam at the LED chip placed on the top of the LED package; and a control unit which is installed in the main body part and controls the operation of the laser module. As a result, the sintering device can heat only an LED chip at high temperatures by selectively heating an LED chip using a laser and curing adhesive, and can improve a curing process by reducing sintering time through rapid heating.