Integrated circuit thermally induced noise analysis

摘要

A system and method are provided for testing an integrated circuit (IC) using thermally induced noise analysis. The method provides an IC die and supplies electrical power to the IC die. The IC die surface is scanned with a laser, and the laser beam irradiated locations on the IC die surface are tracked. The laser scanning heats active electrical elements underlying the scanned IC die surface. A frequency response of an IC die electrical interface is measured and correlated to irradiated locations. IC die defect regions are determined in response to identifying location-correlated frequency measurements exceeding a noise threshold. For example, a frequency measurement may be correlated to a die surface location, and if frequency measurement exceeds the noise threshold, then circuitry underlying that surface area may be identified as defective. Typically, die defect regions are associated with measurements in the frequency range between about 1 Hertz and 10 kilohertz.

主权项

1. A method for testing an integrated circuit (IC) using thermally induced noise analysis, comprising:
scanning a powered IC die surface with a laser; tracking laser beam irradiated locations on the IC die surface; measuring a frequency response of an electrical signal received from an IC die electrical interface during the scanning of the powered IC die surface with the laser; correlating irradiated locations to frequency measurements; and, determining IC die defect regions in response to location-correlated frequency measurements exceeding a noise threshold.