Control of film composition in co-sputter deposition by using collimators

摘要

The present disclosure includes a method for control of a film composition with co-sputter physical vapor deposition. In one implementation, the method includes: positioning first and second PVD guns above a substrate, selecting first and second collimators having first and second sets of physical characteristics, positioning the first and second collimators between the first and second PVD guns and the substrate, sputtering at least one material from the first and second PVD guns through the first and second collimators upon application of a first power and second power, wherein the first PVD gun has a first deposition rate from the first collimator at the first power, and the second PVD gun has a second deposition rate from the second collimator at the second power.

主权项

1. A method for depositing at least one material on a substrate using physical vapor deposition, the method comprising:
positioning a first physical vapor deposition gun above a first portion of a substrate; positioning a second physical vapor deposition gun above a second portion of the substrate, wherein the first portion of the substrate and the second portion of the substrate are external to each other; selecting a first collimator having a first set of physical characteristics; selecting a second collimator having a second set of physical characteristics, the second set of physical characteristics being different than the first set of physical characteristics, wherein the first set of physical characteristics and the second set of physical characteristics comprise at least one of an aspect ratio, an aperture size, an aperture shape, and a texture; positioning the first collimator between the first physical vapor deposition gun and the first portion of the substrate; positioning the second collimator between the second physical vapor deposition gun and the second portion of the substrate; sputtering the at least one material from the first physical vapor deposition gun through the first collimator onto the first portion of the substrate upon application of a first power to the first physical vapor deposition gun; and sputtering the at least one material from the second physical vapor deposition gun through the second collimator onto the second portion of the substrate upon application of a second power to the second physical vapor deposition gun, wherein the sputtering of the at least one material from the second physical vapor deposition gun occurs simultaneously with the sputtering of the at least one material from the first physical vapor deposition gun, wherein the first physical vapor deposition gun deposits the at least one material at a first deposition rate from the first collimator at the first power, and the second physical vapor deposition gun deposits the at least one material at a second deposition rate from the second collimator at the second power.