<p>According to an embodiment of the present invention, a chemical vapor deposition apparatus comprises: a body unit which has a plurality of accommodating grooves on one surface and a supporting rod on the other surface and is arranged in a response chamber; pocket units rotationally arranged in each accommodation groove; an operation gas supply unit which supplies operation gas into the accommodation grooves through the supporting rod to rotate the pocket unit; and a heating unit which supplies heat to the operation gas flowing in the operation gas supply unit by heating the operation gas supply unit.</p>
