发明名称 Liquid crystal panel and manufacturing method thereof
摘要 A manufacturing method of a liquid crystal panel, including: manufacturing a first substrate and a second substrate; mixing sealant with alloy particles having low melting points, coating the mixture on the first substrate, and dropping liquid crystals on the first substrate; and bonding the first substrate and the second substrate, heating the two bonded substrates, and then cooling the substrates. Therefore, the manufacturing method can prevent the present golden balls from piercing the common electrodes and further prevent the short circuit of the circuit on the substrate, which improves the yield rate of the liquid crystal panel. Additionally, since the alloy particles are small sized, after the separate alloy particles melt, contacting points between the alloy particles and the common electrodes are increased. Also, contacting resistance between alloy particles, and the contacting resistance between the alloy particles and the substrate are reduced, which improves the conductivity between the common electrodes.
申请公布号 US8908142(B2) 申请公布日期 2014.12.09
申请号 US201213578700 申请日期 2012.06.21
申请人 Shenzhen China Star Optoelectronics Technology Co., Ltd. 发明人 Zhong Xinhui
分类号 G02F1/1339;G02F1/13 主分类号 G02F1/1339
代理机构 Carter, DeLuca, Farrell & Schmidt, LLP 代理人 Carter, DeLuca, Farrell & Schmidt, LLP
主权项 1. A manufacturing method of a liquid crystal panel, comprising: manufacturing a first substrate and a second substrate; mixing sealant with a plurality of alloy particles having low melting points, coating the mixture on the first substrate, and dropping liquid crystals on the first substrate; and bonding the first substrate and the second substrate, heating the two bonded substrates, and then cooling the two bonded substrates; wherein the mixture of the sealant and the alloy particles is coated on an edge of the first substrate, or is coated on four corners of the first substrate, or is coated on a predetermined position on which the mixture is capable of conducting common electrodes of the first substrate and the second substrate; and wherein the step of heating the two bonded substrates and then cooling the two bonded substrates comprises: irradiating the two bonded substrates at a position on which the mixture is coated by ultraviolet light;placing the substrates on a heating device and heating the substrates at a first predetermined temperature; andscanning the substrates at the position on which the mixture is coated and then cooling the substrates.
地址 Shenzhen, Guangdong CN