| 摘要 |
<p>The present invention relates to a polyimide resin, and more particularly, to a polyimide resin prepared by polymerizing a tetracarboxylic acid dianhydride and a compound of chemical formula 1, having chemical formula 2 as a repeating unit, and capable of manufacturing a film having heat resistance and penetration ratio via thermal treatment at a low temperature for a short period of time. In the chemical formulas, R is an aromatic hydrocarbon or a cyclic aliphatic hydrocarbon.</p> |
