| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus which securely holds one side of a wafer having waviness and polishes the other side flat.SOLUTION: In a wafer polishing apparatus having a rotary chuck table 1 for chucking and holding a wafer W, a recessed part 4 into which a peripheral ring 3 for mounting the wafer W can be fitted is provided in the rotary chuck table 1 in close vicinity of a peripheral part of the wafer W. The peripheral ring 3 is fitted into the recessed part so that a top surface of the wafer W slightly protrude inside the peripheral ring 3. The wafer W is mounted inside the peripheral ring 3, water is poured inside the peripheral ring 3, and the wafer W is vacuumed from a lower surface of the wafer W. A space between the wafer W and the peripheral ring 3 is then sealed by surface tension of poured water to keep a vacuum pressure, then the surface of the wafer W is polished under this condition. |
