发明名称 LIQUID REMOVING APPARATUS FOR SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a liquid removing apparatus for a substrate, capable of keeping a flow rate of air of an air knife suitable.SOLUTION: A liquid removing apparatus comprises an inspection device 20, defect information processing means 21, air flow rate control means 22, and liquid removing means 23. The inspection device 20 is means for detecting a foreign substance and a residual liquid on a surface of a substrate 100 after liquid processing as a defect, and includes: an imaging camera 20a for imaging the surface of the substrate 100; and an image processing section 20b for extracting a defect from a captured image. The defect information processing means 21 is means for processing the number of detected defects obtained from the inspection device 20 in units of divided areas on the substrate surface and outputting the number to the air flow rate control means 22 as defect information. On the basis of the information about the number of defects acquired from the defect information processing means 21, the air flow rate control means 22 controls a flow rate of air emitted from an air knife 23C which is provided in the liquid removing means 23, to the substrate surface.</p>
申请公布号 JP2014229733(A) 申请公布日期 2014.12.08
申请号 JP20130107862 申请日期 2013.05.22
申请人 TOPPAN PRINTING CO LTD 发明人 YAMASHITA TAKASHI;WATANABE TAKASHI;ARAHORI KAZUMA
分类号 H01L21/304;G02B5/20 主分类号 H01L21/304
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