| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device capable of removing a surface protection member from a laser-processed workpiece.SOLUTION: Provided is a laser processing device irradiating a rear surface of a workpiece with a laser beam via an adhesive tape to perform laser processing on the workpiece. In the workpiece, a surface protection member is provided on a front surface, and the adhesive tape is adhered on the rear surface, and an outer periphery of the adhesive tape is adhered to an annular frame. The laser processing device comprises: holding means holding the surface protection member side of the workpiece to expose a rear surface of the adhesive tape; laser beam irradiation means irradiating the rear surface of the workpiece held by the holding means with the laser beam via the adhesive tape to perform laser processing on the workpiece; and surface protection member removal means removing the surface protection member from the laser-processed workpiece. |
