| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a product.SOLUTION: A wiring structure 50, in which pads P2 for connection with a DRAM 60 is formed, is provided in the uppermost insulating layer 21 of a wiring board 10. External diameter of the pad P2 in the wiring structure 50 is set smaller than the external diameter of a pad P1 for connection with a MPU 70, and the arrangement interval of the pads P2 is set smaller than that of the pads P1. Consequently, the conductor patterns 54, 55 at a part where the DRAM 60 is mounted can be made fine, without requiring to arrange the all conductor patterns 31-35 on the wiring board 10 in fine pitch. Consequently, manufacturing cost of the wiring board 10 can be reduced.</p> |
