发明名称 LASER CUTTING DEVICE AND LASER CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser cutting device which can perform laser cutting of a laminate without deterioration of a quality of a cut surface.SOLUTION: A chamber 5 is disposed between a lens 4 ad a laminate 10, and the chamber 5 is provided with a transmission window 6 for injection of laser beam 2 into the chamber 5, a gas supply inlet port 7 for introduction of an assist gas into the camber 5, and a slit 9 for outgoing of the laser beam 2 from the chamber 5 and for ejection of said assist gas 8 from the chamber 5. The slit 9 has a shape following an area scanned with the laser beam 2, and a thickness of the laminate 10 at an irradiation position of the laser beam 2 is reduced by the ejection of said assist gas 8.
申请公布号 JP2014226706(A) 申请公布日期 2014.12.08
申请号 JP20130109434 申请日期 2013.05.24
申请人 PANASONIC CORP 发明人 KITAMURA YOSHIAKI;FUNEMI KOJI
分类号 B23K26/38;B23K26/082;B23K26/142 主分类号 B23K26/38
代理机构 代理人
主权项
地址