| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing an optical semiconductor element providing a cured product excellent in heat resistance, UV resistance and low gas permeability, and an optical semiconductor device sealed by the cured product of the resin composition for sealing the optical semiconductor element.SOLUTION: A resin composition for sealing an optical semiconductor element contains (A) organopolysiloxane containing an alicyclic epoxy group and an aromatic hydrocarbon group, (B) a curing agent having a reactive functional group with an epoxy group, (C) a curing catalyst, and (D) an antioxidant. An optical semiconductor element is sealed by the cured product of the resin composition for sealing the optical semiconductor element. |
