BONDING DEVICE, BONDING SYSTEM, BONDING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To appropriately adjust the horizontal positions of a first holding unit which holds a first substrate and a second holding unit which holds a second substrate, and to appropriately bond the substrates.SOLUTION: A bonding method comprises the steps of: imaging a surface of an upper wafer held in an upper chuck with a chuck camera and adjusting the horizontal position of the upper chuck (step S6); adjusting the horizontal positions of the chuck camera and a bridge camera (step S11); imaging a surface of a lower wafer held in a lower chuck with the bridge camera and adjusting the horizontal position of the lower chuck (step S12); readjusting the horizontal positions of the chuck camera and the bridge camera (step S13); readjusting the horizontal position of the lower chuck (step S14); readjusting the horizontal position of the upper chuck (step S15); and bonding the upper wafer and the lower wafer (step S17).