| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method which allow for accurate bonding of the bump of a chip to a lead, even if there are variations in the plating of leads provided on a board.SOLUTION: Image recognition of the arrangement of leads provided on a board is performed, and the reference position of the arrangement of leads is determined from the XY coordinates of the lead. By comparing the centroid position of an alignment mark provided on the board with the centroid position determined from the reference position of the arrangement of leads, the amount of deviation of the XY axis direction and the rotation axis direction is determined and used, as a correction amount of the amount of deviation, in the alignment of the alignment marks of the chip and board. |
