| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method and a device for positioning a semiconductor device, capable of highly accurately performing alignment by visibly recognizing a connection terminal projected on a reflective surface.SOLUTION: A semiconductor device comprises a semiconductor chip 10 including a first connection terminal 11 for wiring connection, a mounting substrate 20 including a second connection terminal 21 for wiring connection, the second connection terminal electrically connected to the first connection terminal 11, and a reflective surface 34 which reflects light. The reflective surface 34 reflects light from the first connection terminal 11 and the second connection terminal 21 in a thickness direction of the mounting substrate 20. |
