| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a piezoelectric substrate which is small in the quantity of deformation owing to the change in temperature, and is arranged so that a high strength of bonding between a piezoelectric layer and a support layer can be maintained even after having gone through a process which causes a shear force to act on an adhesive.SOLUTION: A piezoelectric substrate comprises: a piezoelectric layer; and a support layer laminated on the backside of the piezoelectric layer through an adhesive layer, and having a linear expansion coefficient smaller than that of the piezoelectric layer. The adhesive layer has a cure shrinkage of 5% or less. The adhesive layer may have a Young's modulus of 1 GPa or less at 150°C. The adhesive layer may have a tension shear adhesion strength of 100 kgf/cmor more at 25°C. The piezoelectric layer may include, as a primary component, lithium tantalate or lithium niobate. The support layer may include, as a primary component, sapphire, aluminum oxide, magnesium oxide, spinel, mullite or silicon.</p> |
