发明名称 HOLDING STRUCTURE OF BONDER
摘要 PROBLEM TO BE SOLVED: To provide a novel holding structure of a bonder capable of stably holding the bonder with high work efficiency.SOLUTION: A pair of support pieces 48a and 48b are projected in parallel with each other from a supporting surface 24 that supports a bonder 28, a bonder holding slit 50 is formed between opposing surfaces of the support pieces 48a and 48b, and a protective member 34 is press-fitted into the bonder holding slit 50 in a horizontal direction, the protective member 34 being configured to cover a terminal connection part 38 formed by mutually connecting terminals of a plurality of branches 32a, 32b, 32c, ... in the bonder 28. Thus, the bonder 28 is held between the support pieces 48a and 48b.
申请公布号 JP2014230378(A) 申请公布日期 2014.12.08
申请号 JP20130107732 申请日期 2013.05.22
申请人 SUMITOMO WIRING SYST LTD 发明人 MATSUMOTO MASAYUKI
分类号 H02G3/30;F16B5/12;H02G3/16 主分类号 H02G3/30
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