发明名称 FILM CUTTING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a film cutting device capable of reducing the generation of whiskers or chips during cutting, while preventing the damage of a sheet surface when positioning.SOLUTION: A film cutting device includes: a stage which has a supporting surface supporting a cut sheet, and a slender opened on the supporting surface and extending so as to intersect the cut sheet; a retaining plate disposed above the cut sheet so as to correspond to the slender opening portion; a retaining plate drive portion for making the retaining plate abut on an upper surface of the cut sheet, and putting the cut sheet between the retaining plate and the supporting surface of the stage to fix that; a cutting tool disposed under the slender opening portion; a first cutting tool drive portion for moving a tip of the cutting tool in a direction projecting/retracting from/to the slender opening portion; and a second cutting tool drive portion for moving the cutting tool in a longitudinal direction of the slender opening portion.</p>
申请公布号 JP2014226729(A) 申请公布日期 2014.12.08
申请号 JP20130105449 申请日期 2013.05.17
申请人 DAINIPPON PRINTING CO LTD 发明人 SHIRASAWA NATSUKI
分类号 B26D1/18;B26D3/00;B26D7/02;B26D7/20 主分类号 B26D1/18
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