| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition device capable of making film quality distribution in a film deposition face of a film deposition object uniform.SOLUTION: A film deposition device for heating and evaporating a film deposition material Ma by a plasma beam P in a vacuum chamber 10, and adhering an evaporation particle Mb of the film deposition material to a film deposition object 11 comprises: a plasma source 7 for generating the plasma beam in the vacuum chamber 10; a main hearth 17 that is filled with the film deposition material serving as an evaporation source, and that is a main positive electrode which introduces the plasma beam to the film deposition material or to which the plasma beam is introduced; a ring hearth 6 that is arranged around the main hearth and is an auxiliary positive electrode for inducing the plasma beam; and an evaporation direction adjusting part 21 for changing an orientation of evaporation particles evaporated from the evaporation source every predetermined time. |
