| 摘要 |
PROBLEM TO BE SOLVED: To stably remove a resin body formed on a resin supply path in a sealing step.SOLUTION: A sub through-hole THs is formed on a sub runner part Lrs of a lead frame LF. The sub through-hole THs has a portion THs1 positioned on the side of a main runner part Lrm, and a portion THs2 positioned on the side of a gate part Lg closer to the portion THs 1, in an extending direction XY1 of the sub runner part Lrs. An opening width Tw1 of the sub through-hole THs in the extending direction XY1 of the sub runner part Lrs is larger than an opening width Tw2 of the sub through-hole in a direction XY2 perpendicular to the direction XY1, in plan view. The opening width of the sub through-hole THs in the direction XY2 becomes gradually smaller toward the end on the side of the gate part Lg of the portion THs2 from the portion THs1, in plan view. |
