发明名称 GRINDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a grinding method for a laminated workpiece that allows an upper-side tabular workpiece to be ground to an even thickness without being affected by a difference in thickness in a radial direction of a lower-side tabular workpiece.SOLUTION: A grinding method using a grinder includes: a workpiece holding step for holding a lower surface 53 of a first tabular workpiece 51 by using a holding table 10; a first thickness measuring step for measuring at least three spots including an outer peripheral portion and a center portion of the first tabular workpiece 51 and a portion being a radial midpoint of the first tabular workpiece 51 on the basis of the control of a control unit 40, by using thickness measuring means 17, and storing the thickness of the first tabular work-piece 51 in a radial direction in a storage unit 41; and a parallelism adjusting step for adjusting parallelism of a top surface 52 of the first tabular workpiece 51 and a grinding surface of a grinding stone 26b by using parallelism adjusting means 15. Accordingly, a second tabular workpiece 54 laminated on an upper side of the first tabular workpiece 51 can be ground to an even thickness without being affected by a difference in thickness of the first tabular workpiece 51.
申请公布号 JP2014226749(A) 申请公布日期 2014.12.08
申请号 JP20130107897 申请日期 2013.05.22
申请人 DISCO ABRASIVE SYST LTD 发明人 YOSHIDA SHINJI
分类号 B24B41/06;B24B49/02 主分类号 B24B41/06
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