发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having high breakdown resistance amount.SOLUTION: A semiconductor device includes: a first element 1 that is a normally-on transistor composed of a nitride compound semiconductor; a second element 2 that is a transistor connected in series to the first element 1 and having a lower withstand voltage between a source and a drain than the first element 1; a first diode 3 connected between a gate of the first element 1 or the second element 2 and a drain of the first element 1 so that a cathode is connected to the drain, and having a predetermined avalanche withstand voltage; and a first resistor 4 connected to the gate to which the first diode 3 is connected. The avalanche withstand voltage of the first diode 3 is lower than the breakdown voltage of the first element 1.
申请公布号 JP2014229755(A) 申请公布日期 2014.12.08
申请号 JP20130108304 申请日期 2013.05.22
申请人 FURUKAWA ELECTRIC CO LTD:THE;FUJI ELECTRIC CO LTD 发明人 UENO KATSUNORI
分类号 H01L21/337;H01L21/329;H01L21/338;H01L21/822;H01L27/04;H01L27/06;H01L27/095;H01L29/778;H01L29/808;H01L29/812;H01L29/861;H01L29/866;H01L29/868 主分类号 H01L21/337
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