| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure that prevents damage to a through-hole caused by a thermally expanded through-electrode.SOLUTION: The package structure includes: a first substrate 10 which has a first surface 10a and a second surface 10b, and has through-holes 11a and 11b passing through from the first surface to the second surface; an element 20 which is arranged on the first surface 10a of the first substrate 10, and has element electrodes 23a and 23b; a second substrate 30 which is arranged on the element 20; through-electrodes 12a and 12b which are arranged inside the through-holes 11a and 11b, are narrower than the through-holes, are electrically connected with the element electrodes 23a and 23b, and are extended between the first surface 10a and the second surface 10b; and fillers 13a and 13b which are filled between inner walls of the through-holes 11a and 11b and the through-electrodes 12a and 12b, and absorb deformation due to the thermal expansion of the through-electrodes 12a and 12b by deforming themselves to prevent the deformation due to the thermal expansion of the through-electrodes 12a and 12b from being spread to the first substrate 10. |
