| 摘要 |
<p>The present invention is to minimize a deviation in the diameter of a hole made by heat and enhance the quality of processing even in case where a processing path is minimized. To realize the purpose, the present invention include the steps of segmenting a print substrate to which laser is scanned into a plurality of scan areas (S1); sorting the order of drilling in the scan areas to make the distance of scanning path minimized (S2); replacing the order of N+1 hole with the N+2 hole when the distance between the N hole and N+1 (N is an integer, [1<=N<= a maximum number of drilled holes -1]) hole is less than a predetermined critical value (S3); when the distance between the N hole and the N+1 hole is less than the critical value, processing the N hole, stopping the processing for predetermined time (T), and then resume processing.</p> |
