发明名称 LASER PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent burning damage or flaw damage in a surface of a transparent resin lens body 40 for sealing an optical semiconductor element installed in respective sections of a substrate surface, in laser processing for cutting a substrate 10.SOLUTION: A laser processing method includes a forward passage cutting process of cutting by irradiating a laser beam L up to its central position C from a starting end side position 30a of a first row section 31 along a cutting expected line 20 of the substrate 10, stopping irradiation of the laser beam L up to the starting end side position 30a of a second row section 32 from the central position C of the first row section 31 and also cutting the respective sections 60 up to its central position C from the starting end side position 30a of the respective row sections by repeating irradiation and stopping of the laser beam L up to the final row section, and a backward passage cutting process of cutting by irradiating the laser beam L up to its central position C from a tail end side position 30b in the final row section of the cutting expected line 20 via this forward passage cutting process and also cutting the respective sections 70 up to its central position C from the tail end side position 30b of the respective row sections by repeating the irradiation of the laser beam L up to the first row section 31.
申请公布号 JP2014226682(A) 申请公布日期 2014.12.08
申请号 JP20130106966 申请日期 2013.05.21
申请人 TOWA CORP 发明人 OKAMOTO JUN;KITADA RYOJI;UZAWA HIDETOSHI
分类号 B23K26/38;B23K26/142;B23K26/40;H01L21/301 主分类号 B23K26/38
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