METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component device capable of enhancing followability of a sealing sheet to the electronic component.SOLUTION: A method for manufacturing an electronic component device comprises: a step A of preparing a laminate in which a plurality of electronic component are mounted on a mounting body; a step B of preparing a thermosetting sealing sheet in which the length of an outer periphery is not less than 500 mm; a step C of arranging the laminate on a hot plate with the surface mounted with the electronic component up and arranging the sealing sheet on the surface mounted with the electronic component of the laminate; and a step D of sealing the electronic component by embedding the electronic component in the sealing sheet by hot pressing after the step C.