| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive ink which enables formation of a highly conductive copper film even when heated at low temperature.SOLUTION: The conductive copper ink composition comprises formic acid copper, dimethylaminoethanol, formic acid and water. The conductive copper ink composition further comprises polycarboxylic acid. The polycarboxylic acid is at least one selected from the group consisting of oxalic acid, citric acid, malic acid, tartaric acid, malonic acid, and succinic acid. |
