TRANSFER PRINTING SUBSTRATE, METHOD OF MANUFACTURING TRANSFER PRINTING SUBSTRATE, AND METHOD OF TRANSFER PRINTING

摘要

PROBLEM TO BE SOLVED: To provide a transfer printing substrate capable of implementing a high transfer yield and a high degree of alignment and maintaining a stable bonding force between a handling substrate and an ultra-thin film substrate while minimizing damage to an element by using a pillar structure and a sacrificial layer.SOLUTION: A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. The alignment of a transfer layer on a normal position is performed by a structural constraint imposed by the pillar structures and a recessed structure formed on the bottom face of the transfer layer corresponding to the pillar structures or the chemical bond of the pillar structures and the transfer layer. In the alignment on the normal position by the structural constraint, a remaining sacrificial layer after being removed may serve as an adhesive component. A transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemical bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate. Such a transfer printing substrate and a method of transfer printing using the transfer printing substrate have a high degree of alignment and a high transfer yield, and can transfer a flexible ultra-thin film element on various transfer surfaces.