| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which improves isolation characteristics and can be miniaturized.SOLUTION: The surface acoustic wave device includes: a wiring board 5; a first electronic element 2 comprising a first element substrate 2a, a first functional body 2b, a first wiring pattern 2c extending to the outer peripheral side of the first element substrate 2a, and a first element pad 2d electrically connected to the first wiring pattern 2c; and a second electronic element 3 comprising a second element substrate 3a positioned inside the outer periphery of the first element substrate 2a, a second functional body 3b, a second wiring pattern 3c extending to the outer peripheral side of the second element substrate 3a, and a second element pad 3d electrically connected to the second wiring pattern 3c. The first electronic element 2 and the second electronic element 3 are arranged on the upper surface 5aa side and the lower surface 5ab side of the wiring board 5 respectively with the wiring board 5 interposed therebetween.</p> |
