| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology capable of inhibiting corrosion of a dicing tape and ensuring strength of a semiconductor wafer.SOLUTION: A semiconductor device manufacturing method comprises: a support process of attaching a surface 11 of a semiconductor wafer 1 to a support plate 4 to expose a rear face 12; and a thinning process of grinding the exposed rear face 12 of the semiconductor wafer 1 to thin the semiconductor wafer 1. The manufacturing method further comprises: a reinforcement process of attaching a reinforcement tape 2 to the rear face 12 of the thinned semiconductor wafer 1; a removal process of removing the support plate 4 from the surface 11 of the semiconductor wafer 1; and a metal film formation process of forming a metal film 6 on the surface 11 of the semiconductor wafer 1 in a state where a dicing tape 3 is not arranged on the rear face side of the semiconductor wafer 1.</p> |
