发明名称 METHOD FOR MANUFACTURING POLYMER SUBSTRATE HAVING METAL LINES BUILT
摘要 <p>The present invention relates to a method for manufacturing a polymer substrate having a metal wire formed therein. The method includes a surface treatment step, a metal seed supply step, and a wire formation step. In the surface treatment step, the surface treatment is performed by irradiating a laser beam onto an area where a metal wire is to be formed in the surface of a polymer substrate. In the metal seed supply step, a metal seed material is supplied to the area where the metal wire is to be formed. In the wire formation step, the metal wire is formed on a metal seed layer coated by the metal seed material. The surface treatment step and the metal seed supply step are simultaneously carried out.</p>
申请公布号 KR101469558(B1) 申请公布日期 2014.12.05
申请号 KR20130089988 申请日期 2013.07.30
申请人 LTS CO., LTD. 发明人 PARK, HONG JIN;LEE, KYUNG HA
分类号 H01Q1/38;H01Q1/24 主分类号 H01Q1/38
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