发明名称 MOUNTING STRUCTURE OF COOLING-MODULE
摘要 <p>The present invention relates to a mounting structure of a cooling module combined with an opening of an FEM carrier comprising: a mounting rubber mounted on the upper end of the cooling module; and an upper panel mounted on the FEM carrier to form the upper side of the opening where a mounting hole to which the mounting rubber is combined is punched. A combining part having the outer diameter bigger than the inner diameter of the mounting hole is formed on the upper end of the mounting rubber, and a projection is formed under the combining part. Moreover, the projection is fixated to the mounting hole as the combining part is elastically restored when passing through the mounting hole after the combining part is elastically deformed and inserted into the mounting hole. The present invention has an effect of effectively suppressing vibrations by increasing the volume of a rubber material when compared to a conventional structure, and reduces the manufacturing costs by reducing the number of components and assembly processes as the conventional mounting bracket is removed, and the mounting rubber which is a vibration isolator is directly mounted on the upper panel.</p>
申请公布号 KR20140139185(A) 申请公布日期 2014.12.05
申请号 KR20130059474 申请日期 2013.05.27
申请人 HYUNDAI MOTOR COMPANY;KIA MOTORS CORPORATION 发明人 LEE, WON MAN
分类号 B60K11/00;B60K11/02;B60K11/06;B62D25/08 主分类号 B60K11/00
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