Multilayer Chemical Mechanical Polishing Pad Stack With Soft And Conditionable Polishing Layer

摘要

A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.

主权项

1. A multilayer chemical mechanical polishing pad stack, comprising:
a polishing layer having a polishing surface, a base surface and an average thickness, TP-avg, measured in a direction perpendicular to the polishing surface from the polishing surface to the base surface; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side;wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and,
optionally, a release liner; wherein the optional release liner is disposed on the platen side of the pressure sensitive platen adhesive layer.